Based on the Power semiconductor device requirements of small size, fast switching speed and fast heat dissipation, TDHD (Three dimensional heat dissipation) packaging products were independently developed by our company after summarizing many years of experience in the design and application of power devices. Less than the size of PDFN5X6, the dissipation power is more than 2 times, the package inductance, package internal resistance, package thermal resistance switch speed greatly improved, MOS itself greatly reduce heat dissipation greatly improved. In 2020, the project will be completed with theoretical proof of concept, market research and preliminary experiments, the 2021 will start purchasing basic equipment to decorate the workshop and gradually improve the process details, and in April 2022, all process problems will be solved, mass production was launched in May. This product is expected to be smaller than 5x6 to replace the traditional packaging PDFN5X6, to -252, to -220, etc. .